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 55 Commerce Way
Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com
GHB-1104R-YG
Features
! 3.0mmx1.0mm SMT LED, 2.0mm THICKNESS. ! LOW POWER CONSUMPTION. ! WIDE VIEWING ANGLE. ! IDEAL
Description
The Mega Green source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode.
FOR BACKLIGHT AND INDICATOR. AND LENS TYPES AVAILABLE.
3.0x1.0mm SMD CHIP LED LAMP
! VARIOUS COLORS ! PACKAGE :
2000PCS / REEL.
Package Dimensions
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.15(0.006") unless otherwise noted. 3. Specifications are subject to change without notice.
REV NO: V.3
DATE: DEC/29/2002
PAGE: 1 OF 4
Selection Guide
P ar t No.. Pa No art No. D i ce ic Lens Typ L ens Ty pe ens Ty s Iv (mcd) Iv (m c d ) (mcd d @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 80 120 Viewing Viewin g View in i Angle
GHB-1104R-YG
MEGA GREEN(InGaAIP)
WATER CLE AR
36
Note: 1 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P ar am e t er Pa aramete Peak Wavelength Dominate Wavelength Spectral Line Half-width C apacitance Forward Voltage Reverse Current D ev i c e evic e Mega Green Mega Green Mega Green Mega Green Mega Green Mega Green Ty p.. Ty p yp 574 568 26 20 2.1 2.5 10 Max .. ax x Un its nit nm nm nm pF V uA Tes t C o n d it io ns Test Conditions est s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V
Absolute Maximum Ratings at TA=25 C
P a r a m e t er Paramet Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating / Storage Temperature
Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Mega Green eg a Gr een Gree 1 05 30 1 50 5 -40 C To +85 C
Un its Unit nit mW mA mA V
REV NO: V.3
DATE: DEC/29/2002
PAGE: 2 OF 4
REV NO: V.3
DATE: DEC/29/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.
Recommended Soldering Pattern (Units : mm)
Tape Specifications (Units : mm)
REV NO: V.3
DATE: DEC/29/2002
PAGE: 4 OF 4


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